Seminar"Scalable superconducting quantum annealing machine based on 3D packaging technology and application specific architecture"
Title: "Scalable superconducting quantum annealing machine based on 3D packaging technology and application specific architecture"
Speaker: Dr. Shiro Kawabata, National Institute of Advanced Industrial Science and Technology (AIST)
Quantum annealing is a promising technique which leverages quantum mechanics to solve hard combinatorial optimization problems . D-Wave Systems Inc.  is the first company to commercialize superconducting quantum annealing machine in 2011 and will ship a new machine with 5640 qubits in 2019. However, integration of larger number of qubits as well as improvement of qubit coherence are required for practical applications. In this talk we will overview our technological integration scheme for large-scale superconducting quantum annealing machine in AIST [3,4]. The scalability is achieved by QUIP (QUbit, Interposer and Package substrate) structure, which is based on our multi-layer fabrication and multi-chip 3D packaging technology such as Through Silicon Via (TSV) and flip-chip bonding. We have also developed an Application Specific Annealing Computing (ASAC) architecture in order to increase the available hardware budget and reduces the cost and time for R&D. In addition, we will explain how to design quantum annealing machine (50 Nb flux qubits) for prime factoring  and theoretical activities on quantum annealing [5,6].
This presentation is based on results obtained from a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO).
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 D-Wave Systems, https://www.dwavesys.com/
 M. Maezawa, G. Fujii, M. Hidaka, K. Imafuku, K. Kikuchi, H. Koike, K. Makise, S. Nakagawa, H. Nakagawa, M. Ukibe, S. Kawabata, arXiv:1809.01425
 V. Karanikolas, S. Kawabata, arXiv:1806.08517
 Y. Seki, S. Tanaka, S. Kawabata, arXiv:1901.02242