Sample Preparation Equipment Gallery

---

For external usage enquiries, contact: research_equipment*oist.jp

For regular enquiries, contact the Engineering Support Section: nanofab*oist.jp

(Please replace* by @)

 

---

 

Sputtering

Model: Hitachi MC1000

Features: EM preparation, Carbon deposition, metal deposition

Link: MC1000

Location: Lab2-A647

 

Plasma Cleaner

Model: SPI - Plasma Prep III

Features: O2 plasma; Resist removal

Link: Plasma Prep III

Location: Lab2-A645 cleanroom

 

UV Ozone Cleaner

Model: Jetlight - 42-100

Features: Surface treatment and resist removal

Link: Jetlight 42-100

Location: Lab2-A645 cleanroom

 

Polisher / Grinder

Model: South Bay Technology - Model 900

Features: 8" grinding polishing wheel, diamond disk with different grain.

Link: SBT Model900

Location: Lab2-A647

 

Dicer

Model: Disco DAD322

Features: Dicing up to 6" wafers (Silicon, Glass, Saphire...)

Link: DiscoD323

Location: Lab2-A647

 

Scriber

Model: Musashino-Denshi SC-100

Features: Manual scribber, up to 4" sample

Link: MS SC-100

Location: Lab2-647

 

Lamp furnace - Rapid Thermal Annealer

Model: ULVAC MILA-5000-P-N

Features: High speed heating (50°C/s), under Vacuum, gas, air. Precise temperature control

Link: Mila 5000 series

Location: Lab2-A645 cleanroom

 

Wedge Wire Bonder

Model: Kulicke and Soffa 4523AD

Features: Electical connection using Wedge Bonding (Al and Gold wire)

Location: Lab2-A647

 

 

Ball bonder

Model: TPT HB-16

Features: Electrical connection using Ball bonding (only Gold wire)

Link: TPT HB16

Location: Lab2-A657c

 

Glovebox

Model: Unico UN-1000L

Features: Nitrogen Glovebox

Link: Unico UN-1000

Location: Lab2-A645 cleanroom