Nanofabrication Equipment Gallery

External usage enquiries (research_equipment*oist.jp) (replace* by @)

Engineering Section (nanofab*oist.jp) (replace* by @)

FIB-SEM

Maker: FEI

Model: Helios G3 UC

Features: Direct write; Imaging; Deposition; Max. Ga ion acceleration voltage: 30 kV; Max. SEM acceleration voltage: 5 kV

E-beam Lithography

Maker: Elionix

Model: ELS-7500EX

Features: Max. acceleration voltage: 50 kV; Min. feature size 10 nm

Maskless Lithography

Maker: Nano System Solutions

Model: Dlight DL-1000

Features: Rapid prototyping; Resolution 1 µm

Mask Aligner

Maker: Suss Microtech

Model: MA6/BA6

Features: Top side alignment; Bottom side alignment; UV nanoimprint lithography

3D Laser Lithography

Maker: Nanoscribe GmbH

Model: 3D Photonic Professional GT

Features: 3D additive manufacturing; Maskless lithography; Writable area (xy) 100 x 100 mm²

Selective Laser Etching

Maker: LightFab GmbH

Model: LightFab 3D Printer

Features: Selective laser etching; Laser ablation; Resolution <20 µm

ICP-CVD

Maker: Oxford Instruments

Model: PlasmaLab 100

Features: Thin film deposition; Dry etch; Multiple gasses

Sputtering

Maker: ULVAC

Model: CAM-S

Features: Thin film deposition; Multiple materials

E-beam Evaporator

Maker: Kawasaki Science

Model: KE604TT1-TKF1

Features: Thin film deposition; Multiple materials

E-beam Evaporator

Maker: Plassys

Model: MEB550S

Features: Thin film deposition; Multiple materials; Automation; Load lock

Parylene Coater

Maker: SCS Coatings

Model: Labcoater 2, PDS2010

Features: Conformal coating; Thin film depositon

Atomic Layer Deposition

Maker: Cambridge Nanotechnology

Model: Savannah S200

Features: Thin film deposition; Multiple materials available

Plasma Treatment System

Maker: Nordson-March

Model: AP-300

Features: Automatic tuning

Acid-Base Etch

Maker: Dalton

Features: Acid resistant work surface

HF Etch

Maker: Dalton

Features: HF resistant work surface